涂层铝片
介 紹
Introduction
電子產品已往短、小、輕、薄及高品質方向發展，細線路的設計也隨之增加，在孔徑變小密度提高下，孔數以驚人的數目倍增，鑽孔的品質及精準度也就變得愈來愈值得重視，然而純鋁箔或酚醛樹脂材質的蓋板已漸漸不適用於微小孔，因此發展出一種利用不同硬度變化可提高孔位精準度、降低斷針率、提高鑽孔品質的蓋板。
The trend of electronic products has been focusing on thin and light with outstanding quality. Trace Miniature design is therefore become majority. As a result of minimized aperture and high density, the number of bores has boosted up tremendously. Its quality and precision has also become more and more important. However, entry boards made of pure AL foil or CAM are unable to meet the requirement of such size of drilling. Latest technology has been developed to create various hardness of buffer layer on board so to increase positioning precision, minimize drill damage and so obtain high
quality.
影響鑽孔品質之因素
Drilling Quality factors
蓋板採用特殊表面處理-1
Special surface treatment of board-1
蓋板表面有軟中硬的硬度變化，能使鑽針精確地對準被鑽孔的位置，有效減少增長刃鑽針斷針，具有散熱與鑽針潤滑功能，有效延長鑽針壽命並且提高CPK值及改善孔壁粗糙度。
Surface of the baord has hard, mid, and soft variances of hardness, and help driller to aim the location of the target precisely, which will effectively reduce the chances of breakup. Also it improves the thermal and lubrication of driller, can effectively extend the drilling life, increase its CPK and improve the roughness of the wall of hole.
可避免鑽針溝尾纏屑問題。
Avoid the residue on the suface of driller end.
可輕易清洗研磨鑽針問題。
Easy to clean and grind.
適用範圍
(1)PCB 或 BGA 鑽孔單位。
(2)可配合客戶端之鑽針幾何設計，進而量身訂做蓋板之操作條件。
Application
(1)PCB or BGA drilling.
(2) Customization to the geometric design of Driller and the operation condition of cover board.
蓋板採用特殊表面處理-2
Special surface treatment of board-2
存放條件
(1)溫度攝氏30度以下，濕度60％以下，水平置放。
(2)產品穩定使用期限為180天。
Storage
(1) 30℃ & RH 60%, horizontal placement.
(2) The product stability lifespan of 180 days.
使用方法
1.霧面朝上(定位用) ，亮面朝下(壓毛邊)。
2.鑽針排屑所需高度約1.5~4倍鑽針直徑。
3.貼於基板上方，鑽針下鑽第一接觸面。
4.注意貼膠帶是否蓋板服貼於基板上。
5.蓋板不可有摺痕、刮傷。
Direction
1. Atomized side up (for position), polished side down (pressing the hairiness).
2. Residue elimination need 1.5~4 times height of driller diameter.
3. Attach to the upper side of substrate, the first touched surface of driller drilling.
4. Ensure that board is thoroughly patched.
5. Must not have any scratch or fold on board.
